US0005614024A19970325US5614024A19970325US5614024US28100194National19940727JP1962449319930806JPJP19930196244JP2812329319931110JPJP199302812325-1962445-281232B05B 12084LI20130101EPBHB05B 12124LI20130101EPBHH05K 31241FI20130101EPBHB05B 12/12 20060101A I20051008RMEP 20060101ALI20051008RMEPB05B1212H05K 3/12 20060101A I20051008RMEP 20060101ALI20051008RMEPH05K312Apparatus for applying pasteUS4919967A19900424US5052338A19911001US5387288A19950207US5437727A19950801JPH0252742A19900222ISHIDA SHIGERUJPYAWATA SATOSHIJPYONEDA TOMIOJPMISHINA HARUOJPIMAIZUMI KIYOSHIJPKAWASUMI YUKIHIROJPISHIDA; SHIGERUYAWATA; SATOSHIYONEDA; TOMIOMISHINA; HARUOIMAIZUMI; KIYOSHIKAWASUMI; YUKIHIROHITACHI TECHNO ENGJPHITACHI TECHNO ENGINEERING CO., LTD.HITACHI TECHNO ENGJPHITACHI TECHNO ENGINEERING CO., LTD.An apparatus for applying a paste to a surface of a substrate by holding the substrate on a table and by moving a nozzle relative to the table to form a desired paste pattern on the substrate. The apparatus has a device for measuring the position of a paste ejection orifice of the nozzle, a processing unit for calculating, from a result of the measurement by the measuring device, a displacement of the position of the paste ejection orifice when the nozzle is changed, and a mechanism for positioning the substrate at a desired position with respect to the ejection orifice of the changed nozzle on the basis of a result of the operation of the processsing unit. With this arrangement, even if the position of the ejection orifice of the nozzle is changed when the nozzle is changed, the desired positional relationship between the nozzle and the substrate can be set with improved accuracy, whereby a paste pattern can be drawn accurately.